NASA’s editor team reached out to us again this year, to introduce the improvements of innovative CubeSat structures previously shortlisted in their original study. We were honored to present the upgraded version of our structure, that uses backplane PCB for bus communication which is intended to provide independent assembly order, simplifies the stack-up tolerances, and uses space graded interface connectors. Its benefits include high reliability electronic/ structural and thermal connections, access to individual cards and units during integration and testing, along with dedicated and independent thermal interfaces for all cards. We do hope that the next period brings an increased number of innovations on the CubeSat market, so that NASA will have to publish an updated study in the foreseeable future, with even more of our state-of-the-art products included. We already know how we can impress engineers of the future and readers of the NASA study next time.
C3S participates on European Space Thermal Engineering Workshop 2021
Predicting the space environment is vital while designing a satellite, knowing hot or cold the components will get while in space in either direct sunlight or facing the dark space is a complicated task. Today our thermal engineers Zsolt Péterbencze and Tamás Henczi...
